Figure 1: Comparison between 3D (left) and 2.5D (right) simulations for the melt front

Figure 2: Comparison between 3D and 2.5D simulation for the gate pressure

Figure 3: Filling patterns of 3D simulation of gear part

Figure 4: Filling patterns of 3D simulation of optical fiber connector

Figure 5: 3D simulation of pressurized underfill of a IC package with 4x4 solde