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Figure 1. Mid-plane model (2.5D model) |
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Figure 3. Rectangular plate with cooling system |
Figure 2. The 3D models have the same thickness with different structure |
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Figure 4. Non-uniform distribution of temperature at
end of cooling |
Figure 5. Warpage simulation of rectangular plate |
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| Figure 6. Filling simulation of T model (90%) |
Figure 7. Simulation of sink mark of T model (scale x30) |
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Figure 8. Filling simulation of electronic connector
(80%) |
Figure 9. Warpage simulation of electronic connector (scale x20) |
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Figure 10. Filling simulation of mobile phone cover
(95%) |
Figure 11. Warpage simulation of mobile phone cover (scale x20) |
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| Figure 12. Filling simulation of electronic part (90%) |
Figure 13. Warpage simulation of electronic part (scale x20) |
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| Figure 14. The racks of electronic part |
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